High Performance Computing Hardware

Intel: Core i7, Xeon-E3, Xeon-D, Xeon-E5/E7

• Freescale (now NXP): T208x
• GPGPUs (NVIDIA & AMD)

High speed data interface and protocol {PCle Gen3, 10/40GbE, lnfiniband)

I/O Connectivity for HPEC

• RDMA Over Ethernet (iWARP): Low latency, High throughput, Zero copy capability, OS/Stack bypass
• Multiware: Seamless PCle data management in multiprocessor system.
• QPI, allows multiple server-class Xeon processors to be linked into a single SMP processing architecture



Micro Via Radial Interconnect (MVRI) technology has improved OpenVPX switch fabric interconnect data rates by three-fold, enabling switch fabrics and point-to-point connections to run faster and more reliably.




3U/6U VPX Module Agnostic Cooling

• Air Cooling can handle up to a around 200W per module
• Conduction Cooling can handle up to a around 150W per module
• Air Flow-by Cooling can handle up to a around 200W per module
• Common to ALL these solutions is just one PWA