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  • VPX Backplanes
  • Hybrid Backplanes
  • VITA 67 Backplanes
  • VME Backplanes
  • VXS Backplanes
  • cPCI
  • Power Interface Board

Blaze 3U/6U VPX (Bx series)

  • Compliant with VITA 46.0 & VITA 65 Open VPX specification
  • 0.8” / 0.85” / 1.0” Card Pitch
  • 3U or 6U Form Factor
  • Slot / Backplane / Module Profile as per VITA65
  • PCB Layer: 12/16
  • Backplane Connectors: High Speed MULTI-GIGRT-2
  • Flexible keying and alignment mechanism
  • Power connections at rear for VS1, VS2, VS3, AUX & Ground
  • Keying & Alignment Mechanism
  • Extended Operating Temperature: -40°C to 85°C
  • Custom Designs


Blaze Hybrid (Bi series) - Hybrid Backplanes

  • As per ANSI/VITA 1.1-1997
  • Compliance with VITA 46.0 & VITA 65 Open VPX specifications
  • VME-VPX Hybrid Backplane
  • Full Mesh Technology
  • M3 Power Taps
  • 12 layered PCB
  • 0.8 & 1.0” Slot Pitch
  • Switchless Point-to-Point
  • Flexible keying and alignment mechanism
  • With geographic address pins
  • Superior Power Distribution
  • High Speed P0 MultiGig RT2 Connector for VXS
  • PCB FR-4/Rogers
  • Zero Cross-talk
  • Extended Operating Temperature: -40°C to 85°C
  • Custom Designs


VITA 67 Backplane

  • VITA 67 Backplane provides High Speed Analog/RF Signal directly to the backplane
  • VITA 67 Backplane enables the use of high-speed serial switch fabric technologies such as Ethernet, PCI Express, sRIO
  • VITA 67 Backplane is available in 3U, 6U, or virtually any other custom configuration needed
  • Robust and rugged high speed solution for RF/Analog Signals
  • Quick replacement of modules providing lower Mean-Time-To-Repair (MTTR)
  • Flexible keying and alignment mechanism
  • Geographical address pin.
  • Improved modularity and scalability of complex architectures
  • Coaxial interconnects in modules can significantly improve isolation from interference and noise.


Blaze VME (Bv series) - VME64x Backplanes

  • As per ANSI/VITA 1.1-1997
  • IEEE 1101.10 Mechanical Standards
  • 02 to 21 slots, 6U VME64x
  • P1/P2/P0
  • Standard Rear I/O
  • With PIB as per PICMG2.11
  • FR4 PCB, 4.2mm thick
  • Excellent Signal integrity
  • Superior Power Distribution
  • Active / Passive bus termination
  • Auto Daisy Chain
  • +5, +3V3 & ±12V Interface Studs
  • Operating Temperature: -40°C to 85°C
  • Custom Designs


Blaze VXS (Bs series) - VXS Backplanes

  • Hybrid VXS + VME64x Backplane
  • Conforms to ANSI/VITA41.x Core Specifications
  • 03 VXS Slots + 03 VME64x Slots Backplane
  • Full Mesh
  • Active BUSGRANT, IACK daisy chain
  • 6U Form Factor
  • 12 layered PCB
  • Point-to-Point connection – No need of switch card
  • Fabric over Multi-Gig RT2 connector
  • PCB FR-4/Rogers
  • Excellent Power Distribution
  • Air and Conduction cooled Payload cards support
  • Extended Operating Temperature: -40°C to 85°C
  • Custom Designs


Blaze 3U/6U cPCI (Bc series) - CPCI Backplanes

  • Conforms to PICMG Standards
  • 3U or 6U Form Factor
  • 02-16 Slots
  • Enhanced 16 Slots Bridged Optional
  • 32/64 Bit PCIbus
  • 8 to 12 layer
  • FR4 PCB or equivalent
  • Excellent power distribution
  • Operating Temperature: -40°C to 85°C
  • Custom Designs


Blaze 3U/6U Power Interface Board(Bp series)

  • Designed to meet power interface specification as per PICMG 2.11
  • Designed to Plug up to 1200Watts PSUs
  • 3U/6U, Dual slot PIB/ Quad slot PIB
  • AC / DC input
  • Dual Positronics P47 Connector Interface for Plug-in PSUs
  • Output Power Bugs with Distribution at rear
  • IEEE1101.10 Mechanical Standards
  • FR4, Minimum 10 Layers PCB
  • Extended Operating Temperature
  • Custom Design