28th March, 2017
Trident Infosol conferred with the Prestigious Defence Technology Absorption Award from DRDO.
Defence Technology Absorption Award was presented by the Hon'blei Defense & Finance Minister, Mr. Arun Jaitley in a formal ceremony at DRDO Bhawan, New Delhi on 24, March 2017. Trident Infosol, Bengaluru have played a role of critical line replacement unit (LRU)s under AEW&C program, which lead to the success of AEW&C program & it’s induction into IAF. Trident Infosol made noteworthy contributions in the development of critical products of AEW&C such as integrated OWS console, integrated OTS console (IOS&TOS), Mission system control (MSC) chassis, Ifftx-Rx chassis, Signal Processing (SP) chassis, Monitoring, Analysis & Recording sub system, C-Band Up-Down Convertor (CBDL) Chassis, Ku-Band Up-Down Converter (KBDC) chassis, Base band Unit (BBU) chassis, Airborne RF System type Chassis & power Supply Interface Boards.
21st February, 2017
Best Contributor for Effective Order Management at Dassault Sales Convention 2016
Recognizing the technological and economic challenges faced by the customers in today's competitive market place, we offer system integration solutions and services meeting various critical application requirements and demanding environmental conditions.
From a basic configuration of COTS cards in a chassis to customized systems configurations. Hardware and software building blocks we reduce the risk by providing single source solution. Integrated systems are delivered more quickly and economically allowing for higher productivity at the application development level and enabling faster time-to-market.
18th February, 2017
Aero Show - 2017
Thanks to one & all for the support extended to particate in Aero Show 2017. It was a great event projecting our Products. Some of the clicks for your view.
Thanks Once Again!!!
22nd July, 2016
Best Distributor 2015
Awarded Best Distributor 2015 by a Interface concept
05th April, 2016
XMC Processor Module
XP B5x/msd provides high performance control and management capability for any carrier card with an XMC site. Based on a low power 6th generation Intel® Core™ processor, XP B5x/msd is suitable for rugged and extended temperature operating environments.
* 6th generation Intel® Core™ processor suitable for long life cycle deployments
* Built in Solid State Drive for reliable storage
* Wide range of I/O interfaces available on XMC connectors
* Extended temperature and rugged versions available
* Support for Linux®, Windows® and VxWorks®
02nd April, 2016
Acromag's New Next Generation PCIe-Based AcroPack™ I/O Modules...
AcroPack™ Series of I/O mezzanine modules and carriers provide a cost-effective solution for a modular approach to system assembly enabling application specific customization.
Wixom, MI: Acromag’s new innovative PCIe-based AcroPack™ Series of general purpose I/O modules for embedded computing applications are an extended version of the mPCIe specification and feature a 100-pin connector to handle the I/O. The modules plug into connectors on AcroPack™ carriers to add analog or digital input and output or communication in any combination for embedded applications running on Linux®, Windows®, or VxWorks® operating systems. Acromag’s AcroPack™ PCIe carrier holds up to two mini-PCIe or AcroPack™ mezzanine modules. Modules start at less than $650 and carriers $750.
Four AcroPack™ mezzanine models will offer 32 isolated digital input model AP440, 32 isolated digital output model AP445, 32 I/O channels with 0 to 60V model AP408, and four or eight UART ports RS232 model AP50x.
03rd May, 2016
Mentor Graphics Announces PADS PCB Product
Mentor Graphics Corporation (NASDAQ: MENT) today announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products. With increasing systems design complexity and the need for printed circuit board (PCB), mechanical and systems engineers to access easy-to-deploy tools, the PADS platform has been extended to enable engineers to develop PCB-based systems from concept through manufacturing hand-off.
The product creation process is much more than schematic capture and board layout. Engineers must address many other issues for a successful product design, including component selection, signal and power integrity, electronic cooling, form and fit, and design for manufacturability. With this release, the PADS platform extends its product-creation solution by adding PADS HyperLynx® DC Drop and PADS FloTHERM® XT tools for high productivity at unprecedented price-performance.