Latest News



  • 05th April, 2016
  • XP B5x/msd provides high performance control and management capability for any carrier card with an XMC site. Based on a low power 6th generation Intel® Core™ processor, XP B5x/msd is suitable for rugged and extended temperature operating environments.

    * 6th generation Intel® Core™ processor suitable for long life cycle deployments
    * Built in Solid State Drive for reliable storage
    * Wide range of I/O interfaces available on XMC connectors
    * Extended temperature and rugged versions available
    * Support for Linux®, Windows® and VxWorks®

  • 02nd April, 2016
  • AcroPack™ Series of I/O mezzanine modules and carriers provide a cost-effective solution for a modular approach to system assembly enabling application specific customization.

    Wixom, MI:  Acromag’s new innovative PCIe-based AcroPack™ Series of general purpose I/O modules for embedded computing applications are an extended version of the mPCIe specification and feature a 100-pin connector to handle the I/O. The modules plug into connectors on AcroPack™ carriers to add analog or digital input and output or communication in any combination for embedded applications running on Linux®, Windows®, or VxWorks® operating systems. Acromag’s AcroPack™ PCIe carrier holds up to two mini-PCIe or AcroPack™ mezzanine modules. Modules start at less than $650 and carriers $750.

    Four AcroPack™ mezzanine models will offer 32 isolated digital input model AP440, 32 isolated digital output model AP445, 32 I/O channels with 0 to 60V model AP408, and four or eight UART ports RS232 model AP50x.

  • 03rd May, 2016
  • Mentor Graphics Corporation (NASDAQ: MENT) today announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products. With increasing systems design complexity and the need for printed circuit board (PCB), mechanical and systems engineers to access easy-to-deploy tools, the PADS platform has been extended to enable engineers to develop PCB-based systems from concept through manufacturing hand-off.

    The product creation process is much more than schematic capture and board layout. Engineers must address many other issues for a successful product design, including component selection, signal and power integrity, electronic cooling, form and fit, and design for manufacturability. With this release, the PADS platform extends its product-creation solution by adding PADS HyperLynx® DC Drop and PADS FloTHERM® XT tools for high productivity at unprecedented price-performance.